P1024-BD

Features: ·Balanced Design Provides Good Output Match·On-Chip Temperature Compensated Output Power Detector·32.0 dB Small Signal Gain·+36.0 dBm Third Order Intercept (OIP3)·100% On-Wafer RF, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Vol...

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SeekIC No. : 004438973 Detail

P1024-BD: Features: ·Balanced Design Provides Good Output Match·On-Chip Temperature Compensated Output Power Detector·32.0 dB Small Signal Gain·+36.0 dBm Third Order Intercept (OIP3)·100% On-Wafer RF, DC and ...

floor Price/Ceiling Price

Part Number:
P1024-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:

·Balanced Design Provides Good Output Match
·On-Chip Temperature Compensated Output Power Detector
·32.0 dB Small Signal Gain
·+36.0 dBm Third Order Intercept (OIP3)
·100% On-Wafer RF, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd) +6.0 VDC
Supply Current (Id) 1700 mA
Gate Bias Voltage (Vg) +0.3 VDC
Input Power (Pin) +5 dBm
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF Table 4
Junction Temperature (Tch) MTTF Table 4


(4) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's four stage 26.0-31.0 GHz GaAs MMIC power amplifier is optimized for linear operation with a third order intercept point of +36.0 dBm. The device also includes Lange couplers to achieve good output return loss and an on-chip temperature compensated output power detector. This P1024-BD MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The P1024-BD chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This P1024-BD device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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