Features: • 0.068 (1.73mm) maximum seated height• Rugged molded case construction with no internal solder• Highly stable thin film• JEDEC MO #137 Package ADDescriptionOSOP Molded, 25 Mil Pitch, Dual-In-Line Resistor Network
OSOP: Features: • 0.068 (1.73mm) maximum seated height• Rugged molded case construction with no internal solder• Highly stable thin film• JEDEC MO #137 Package ADDescriptionOSOP M...
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