OPL531- OC

Features:

·Four out put op tions
·High noise im munity
·Direct TTL/LSTTL CMOS in terface
·Low cost plas tic side- looking pack age
·Mechanically and spec trally matched to the OP140 and OP240 se ries LED's
·Data rates to 250 kBaud
·Low power con sumption


Specifications

Sup ply Volt age, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Storage Tem perature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . -40 to +100
Operating Tem perature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85
Lead Sol dering Tem perature Range [1/16 inch (1.6 mm) from case for 5 sec. with
soldering iron] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . 240
Power Dis sipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  90 mW
Voltage at Out put Lead⁽⁴⁾ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 V
Sinking Cur rent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

Notes:
(1) Derate linearly 2.67 mW/ above 70.
(2) RMA flux is recommended. Duration can be extended to 10 sec. maximum when flow
soldering. Max 20 grams force may be applied to the leads when soldering.
(3) Irradiance measurements are made with i = 935 nm.
(4) OC versions only. For I_CC on pull-up versions add V_CC/10 kW.


Description

The OPL530, OPL530-OC, OPL531, OPL531-OC contain a monolithic integrated circuit which incorporates a photodiode, amplifier, voltage regulator, Schmitt trigger and an NPN output transistor on a single silicon chip.

The OPL530 and OPL531 includes a 10 KW pull-up resistor (RL) from output to VCC. The OPL530-OC and OPL531-OC have an open-collector output.

These devices exhibit very stable performance over supply voltages ranging from 4.5 V to 16 V and a wide range of irradiance levels.

The Photologic^® chip is encapsulated in a molded plastic package which has an integral lens for enhanced optical coupling and minimal optical spacing.