OPA541

Supply Voltage, +V_S to V_S ............................................................... 80V
Output Current .............................................................................see SOA
Power Dissipation, Internal⁽¹⁾ ........................................................... 125W
Input Voltage: Differential .................................................................... ±V_S
Common-mode...................................................................................... ±V_S
Temperature: Pin solder, 10s ........................................................ +300°C
Junction⁽¹⁾ .................................................................................... +150°C
Temperature Range:
AM, BM SM
Storage ....................................................................... 65°C to +150°C
Operating (case) ......................................................... 55°C to +125°C
AP
Storage ......................................................................... 40°C to +85°C
Operating (case) ........................................................... 25°C to +85°C
NOTE: (1) Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF.

The OPA541 is a power operational amplifier capable of operation from power supplies up to ±40V and delivering continuous output currents up to 5A. Internal current limit circuitry can be user-programmed with a single external resistor, protecting the amplifier and load from fault conditions. The OPA541 is fabricated using a proprietary bipolar/FET process.

Pinout is compatible with popular hybrid power amplifiers such as the OPA511, OPA512 and the 3573. The OPA541 uses a single current-limit resistor to set both the positive and negative current limits. Applications currently using hybrid power amplifiers requiring two current-limit resistors need not be modified.

The OPA541 is available in an 11-pin power plastic package and an industry-standard 8-pin TO-3 hermetic package. The power plastic package has a copper- lead frame to maximize heat transfer. The TO-3 package is isolated from all circuitry, allowing it to be mounted directly to a heat sink without special insulators.