OMC506

Features: 10A Average Phase Output Current Over Temperature Protection Compensation Circuitry Adjustable to Motor ParametersSpeed Controlled by 0 to 5V Linear Input Signal Forward or Reverse Direction Isolated, Low Profile PackageSpecifications Parameter Symbol Units Motor Supply Volt...

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SeekIC No. : 004437728 Detail

OMC506: Features: 10A Average Phase Output Current Over Temperature Protection Compensation Circuitry Adjustable to Motor ParametersSpeed Controlled by 0 to 5V Linear Input Signal Forward or Reverse Direct...

floor Price/Ceiling Price

Part Number:
OMC506
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/12

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Product Details

Description



Features:

10A Average Phase Output Current
Over Temperature Protection
Compensation Circuitry Adjustable to Motor Parameters
 Speed Controlled by 0 to 5V Linear Input Signal
  Forward or Reverse Direction
  Isolated, Low Profile Package



Specifications

TBODY>
Parameter Symbol Units
Motor Supply Voltage Vm 32

Vdc

V

Peak Motor Supply Voltage Vm pk 48
Average Phase Output Current Io 10 A*
Pulsed Output Current ( <1% Duty Cycle ) IOP 30
Oscillator Input Current ( Source or Sink ) IOSC 6.5 V
Reference Output Voltage ( IREF = 1.0mA )  VREF 6.5
Digital Inputs ( Fwd / Enable / Brake / SA /SB / SC )   10 mA
Reference Output Current ( VREF = 6.2V ) IREF -0.3 to VREF V
Speed Control Input Voltage  VSPEED -0.3 to VREF mA
Tachometer Input Voltage VTACH 6.2 V
Temperature Control Input Voltage  VCNTL 100 mA
Regulator Output Current ( VREG + 15V ) -0.3 to 5.0 V
Current Sense Input Voltage  VCS -25 to 85 °C
Operating Temperature Range  TOP



Description

The OMC506 is an integrated, high density, three phase Brushless DC (BLDC) motor, speed controller housed in a
MP-3Tpackage. The OMC506 contains the power, driver and control electronics to adjust timing functions and speed
control loop parameters to optimize the controller for each application. The electronics contained in the OMC506 are
assembled using mixed process technologies: surface mount components on a printed circuit board and chip &wire on an Insulated Metal Substrate.This combination offers small size, excellent thermal characteristics and electrically isolated heat sink.


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