OMAP1623B1ZWE

The OMAP1623B1ZWE is one member of the OMAP family which designed as the low-power applications processor. This device has an ARM core (also has a 8KB RAM (Vector Table) and 64KB ROM) and an DSP core (uses a two-level cache-based architecture), the two core enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

Features of the OMAP1623B1ZWE are:(1)real-time clock with 32 KHz oscillator and separate power rail;(2)commercial or extended temperature;(3)256-ball Pb-free plastic ball grid array (PBGA) [ZKB Suffix], 1.0-mm ball pitch;(4)two 32-bit enhanced quadrature encoder pulse modules (eQEP);(5)one host-port interface (HPI) with 16-bit-wide muxed address/data bus for high bandwidth;(6)single shot capture of up to four event time-stamps;(7)one 64-bit general-purpose timer (configurable as two 32-bit timers);(8)multimedia card (MMC)/secure digital (SD) card interface with secure data I/O (SDIO);(9)enhanced direct-memory-access controller 3 (EDMA3);(10)two serial peripheral interfaces (SPI) each.

The absolute maximum ratings of the OMAP1623B1ZWE can be summarized as:(1)storage temperature range:-55°C to 150°C;(2)operating junction temper-ature ranges (default):0°C to 105°C;(3)operating junction temperature ranges (T version):-40°C to 125°C;(4)supply voltage ranges (core):-0.5 V to 1.4 V;(5)supply voltage ranges I/O, 1.8V:-0.5 V to 2 V;(6)supply voltage ranges I/O, 3.3V:-0.5 V to 3.8V;(7)clamp current:±20mA. If you want to know more information such as the electrical characteristics about the OMAP1623B1ZWE, please download the datasheet in www.seekic.com or www.chinaicmart.com .