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NZQA5V6AXV5

Features: • ESD Protection: IEC61000−4−2: Level 4 MILSTD 883C − Method 3015−6: Class 3• Four Separate Unidirectional Configurations for Protection• Low Leakage Current < 1 A @ 3 V• Power Dissipation: 380 mW• Small SOT−553 SMT P...

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SeekIC No. : 004436906 Detail

NZQA5V6AXV5: Features: • ESD Protection: IEC61000−4−2: Level 4 MILSTD 883C − Method 3015−6: Class 3• Four Separate Unidirectional Configurations for Protection• ...

NZQA5V6AXV5 Data Sheet

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Part Number:
NZQA5V6AXV5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/15

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Product Details

Description



Features:

• ESD Protection: IEC61000−4−2: Level 4
 MILSTD 883C − Method 3015−6: Class 3
• Four Separate Unidirectional Configurations for Protection
• Low Leakage Current < 1 A @ 3 V
• Power Dissipation: 380 mW
• Small SOT−553 SMT Package
• Low Capacitance (8 pF Typical @ 3 V)


Application

• Instrumentation Equipment
• Serial and Parallel Ports
• Microprocessor Based Equipment
• Notebooks, Desktops, Servers
• Cellular and Portable Equipment


Pinout

Connection Diagram


Specifications

Rating Symbol Value Unit
Peak Power Dissipation
8 X 20 s Double Exponential Waveform (Note 1)		 PPK

 20

 W
Thermal Resistance −
Junction to Ambient
Above 25°C, Derate		 R JA
327
3.05
°C/W
mW/°C
Operating Junction Temperature Range TJ −40 to +125 °C
Storage Temperature Range Tstg −55 to +150 °C
Lead Solder Temperature − Maximum 10 Seconds Duration TL 260 °C
1. Non−repetitive current pulse per Figure TBD.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min. pad.


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