Features: • INTEGRATED ELECTROABSORPTION MODULATOR• INTERNAL DRIVER IC• UP TO 40 km TRANSMISSION 10 Gb/s (Dispersion: 800 ps/nm)• 19-PIN MINI-BUTTERFLY PACKAGESpecifications SYMBOLS PARAMETERS UNITS RATINGS IFLD Forward Current of LD mA 150 VRLD Reverse Vo...
NX8560MC: Features: • INTEGRATED ELECTROABSORPTION MODULATOR• INTERNAL DRIVER IC• UP TO 40 km TRANSMISSION 10 Gb/s (Dispersion: 800 ps/nm)• 19-PIN MINI-BUTTERFLY PACKAGESpecifications ...
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SYMBOLS | PARAMETERS | UNITS | RATINGS |
IFLD | Forward Current of LD | mA | 150 |
VRLD | Reverse Voltage of LD | V | 2.0 |
VSS | Driver Power Supply Voltage | V | -6 to 0 |
Vm | Modulation Control Voltage of Modulator | V | VSS to VSS +1.2 (0.3 MAX) |
Vb | Bias Control Voltage of Modulator | V | VSS to VSS + 2.4 (0.3 MAX) |
Vx1, Vx2 | Cross Point Control Voltage | V | VSS to VSS + 2.4 (0.3 MAX) |
IFPD | Forward Current of PD | mA | 2 |
VRPD | Reverse Voltage of PD | V | 15 |
IC | Cooler Current | A | 1.5 |
VC | Cooler Voltage | V | 2.5 |
TC | Operating Case Temperature | 0 to +75 | |
TSTG | Storage Temperature | -40 to +85 | |
TSLD | Lead Soldering Temperature (3 sec.) | 30 |