Features: • Low RDS(on) for Higher Efficiency• Logic Level Gate Drive• Miniature ChipFET Surface Mount Package Saves Board Space• Pb−Free Package is AvailableApplication• Power Management in Portable and Battery−Powered Products; i.e., Cellular and Cordles...
NTHS5443: Features: • Low RDS(on) for Higher Efficiency• Logic Level Gate Drive• Miniature ChipFET Surface Mount Package Saves Board Space• Pb−Free Package is AvailableApplicatio...
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Rating |
Symbol |
5 secs |
Steady State |
Unit |
Drain−Source Voltage |
VDS |
−20 |
V | |
Gate−Source Voltage |
VGS |
±12 |
V | |
Continuous Drain Current (TJ = 150°C) (Note 1) TA = 25°C TA = 85°C |
ID |
−4.9 −3.5 |
−3.6 −2.6 |
A |
Pulsed Drain Current |
IDM |
±15 |
A | |
Continuous Source Current (Note 1) |
IS |
−4.9 |
−3.6 |
A |
Maximum Power Dissipation (Note 1) TA = 25°C TA = 85°C |
PD |
2.5 1.3 |
1.3 0.7 |
W |
Operating Junction and Storage Temperature Range |
TJ, Tstg |
−55 to +150 |
°C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq [1 oz] including traces).