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NTHS2101P

Features: • Offers an Ultra Low RDS(on) Solution in the ChipFET Package• Miniature ChipFET Package 40% Smaller Footprint than TSOP−6 making it an Ideal Device for Applications where Board Space is at a Premium• Low Profile (<1.1 mm) Allows it to Fit Easily into Extremely...

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NTHS2101P: Features: • Offers an Ultra Low RDS(on) Solution in the ChipFET Package• Miniature ChipFET Package 40% Smaller Footprint than TSOP−6 making it an Ideal Device for Applications wher...

NTHS2101P Data Sheet

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Part Number:
NTHS2101P
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Offers an Ultra Low RDS(on) Solution in the ChipFET Package
• Miniature ChipFET Package 40% Smaller Footprint than TSOP−6 making it an Ideal Device for Applications where Board Space is at a Premium
• Low Profile (<1.1 mm) Allows it to Fit Easily into Extremely Thin Environments such as Portable Electronics
• Designed to Provide Low RDS(on) at Gate Voltage as Low as 1.8 V, the Operating Voltage used in many Logic ICs in Portable Electronics
• Simplifies Circuit Design since Additional Boost Circuits for Gate Voltages are not Required
• Operated at Standard Logic Level Gate Drive, Facilitating Future Migration to Lower Levels using the same Basic Topology
• Pb−Free Package is Available


Application

• Optimized for Battery and Load Management Applications in Portable Equipment such as MP3 Players, Cell Phones, Digital Cameras, Personal Digital Assistant and other Portable Applications
• Charge Control in Battery Chargers
• Buck and Boost Converters




Pinout

Connection Diagram


Specifications

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
VDSS
VGS
−8.0
±8.0
Vdc
Vdc
Drain Current − Continuous
− 5 seconds
ID
−5.4
−7.5
A
Total Power Dissipation
Continuous @ TA = 25°C
(5 sec) @ TA = 25°C
Continuous @ 85°C
(5 sec) @ 85°C
PD
1.3
2.5
0.7
1.3
W
Continuous Source Current
Is
−1.1
A
Thermal Resistance (Note 1)
Junction−to−Ambient, 5 sec
Junction−to−Ambient, Continuous
RJA
50
95
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8from case for 10 seconds
TL
260
°C



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