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NTGS3446

Features: • Ultra Low R DS(on)• Higher Efficiency Extending Battery Life• Logic Level Gate Drive• Diode Exhibits High Speed, Soft Recovery• Avalanche Energy Specified• IDSS Specified at Elevated Temperature• Pb−Free Package is AvailableApplication...

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NTGS3446: Features: • Ultra Low R DS(on)• Higher Efficiency Extending Battery Life• Logic Level Gate Drive• Diode Exhibits High Speed, Soft Recovery• Avalanche Energy Specified&#...

NTGS3446 Data Sheet

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Part Number:
NTGS3446
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:


• Ultra Low R DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• IDSS Specified at Elevated Temperature
• Pb−Free Package is Available


Application

• Power Management in portable and battery−powered products, i.e. computers, printers, PCMCIA cards, cellular and cordless
• Lithium Ion Battery Applications
• Notebook PC

 




Pinout

Connection Diagram


Specifications

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
20
V
Gate−to−Source Voltage
VGS
±12
V
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp < 10 s)
R JA
P d
I D
I DM
244
0.5
2.5
10
°C/W
W
A
A
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25°C
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp< 10 s)
R JA
P d
I D
I DM
128
1.0
3.6
14
°C/W
W
A
A
Thermal Resistance
Junction−to−Ambient (Note 3)
Total Power Dissipation @ TA = 25°C
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp < 10 s)
RJA
Pd
I D
IDM
62.5
2.0
5.1
20
°C/W
W
A
A
Source Current (Body Diode)
IS
5.1
A
Operating and Storage Temperature Range
TJ, Tstg
−55 to
150
°C
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
TL
260
°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), operating to steady state.
3. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), t < 5.0 seconds.




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