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NTD30N02

Application• Power Supplies• Converters• Power Motor Controls• Bridge CircuitsSpecifications Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Drain−to−Gate Voltage (RGS = 10 M) VDGR 60 Vdc Gate−to−Source...

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SeekIC No. : 004435853 Detail

NTD30N02: Application• Power Supplies• Converters• Power Motor Controls• Bridge CircuitsSpecifications Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60...

NTD30N02 Data Sheet

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Part Number:
NTD30N02
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits


Specifications

Rating Symbol Value Unit
Drain−to−Source Voltage VDSS 60 Vdc
Drain−to−Gate Voltage (RGS = 10 M) VDGR 60 Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp10 ms)		 VGS
VGS		 ±20
±30		 Vdc
Drain Current
− Continuous @ TA = 100°C
− Single Pulse (tp10 s)		 ID
IDM		 30
100		 Adc
Apk
Total Power Dissipation @ TA = 25°C PD 75 W
Operating and Storage Temperature Range TJ, Tstg −55 to
150
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
L = 1.0 mH, IL(pk) = 7.75 A, VDS = 60 Vdc)		 EAS 313 mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)		 RJC
RJA
RJA		 1.65
67
120		 /W
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds		 TL 260
1. When surface mounted to an FR4 board using 1, pad size, (Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using minimum recommended padsize, (Cu Area 0.412 in2).


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