Features: • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING• SUPER LOW ESR & HIGH RIPPLE CURRENT• CAPACITANCE VALUES UP TO 820F• 6.3x6.3mm ~ 10x10.8mm CASE SIZES• DESIGNED FOR REFLOW SOLDERING
NSPE Series: Features: • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING• SUPER LOW ESR & HIGH RIPPLE CURRENT• CAPACITANCE VALUES UP TO 820F• 6.3x6.3mm ~ 10x10.8mm CASE SIZESR...
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