NNCD5.6LG

Features: • Based on the electrostatic discharge immunity test (IEC1000-4-2), the product assures the minimum endurance of 8 kV.• Capacitance is small with 10 pF (at VR = 0 V, f = 1 MHz) between the terminal. It is excellent in the frequencycharacteristic.• With 4 elements mounte...

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NNCD5.6LG Picture
SeekIC No. : 004435005 Detail

NNCD5.6LG: Features: • Based on the electrostatic discharge immunity test (IEC1000-4-2), the product assures the minimum endurance of 8 kV.• Capacitance is small with 10 pF (at VR = 0 V, f = 1 MHz)...

floor Price/Ceiling Price

Part Number:
NNCD5.6LG
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/8

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Product Details

Description



Features:

• Based on the electrostatic discharge immunity test (IEC1000-4-2), the product assures the minimum endurance of 8 kV.
• Capacitance is small with 10 pF (at VR = 0 V, f = 1 MHz) between the terminal. It is excellent in the frequency
characteristic.
• With 4 elements mounted (common anode) in the 5-pin mini mold package, that product can cope with high density
assembling.




Application

• External interface circuit ESD absorption in the high-speed data communication bus such as USB.


Pinout

  Connection Diagram


Specifications

Power Dissipation
Surge Reverse Power
Junction Temperature
Storage Temperature
P
PRSM
Tj
Tstg
200 mW                          (Total)
2W (t = 10 s, 1 pulse)    Fig.5
150 °C
55 °C to +150 °C



Description

NNCD5.6LG series is a low capacitance type diode developed for ESD (Electrostatic Discharge) absorption. Based on the IEC1000-4-2 test on electromagnetic interference (EMI), the diode assures an endurance of no less than 8 kV, and capacitance is small with 10 pF between the terminal. NNCD5.6LG series is the most suitable for the ESD absorption in the high-speed data communication bus such as USB.

With four elements mounted in the 5Pin Mini Mold Package,NNCD5.6LG can cope with high density assembling.




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