NE734

Features: • LOW NOISE FIGURE: < 3 dB at 500 MHz• HIGH GAIN: 15 dB at 500 MHz• HIGH GAIN BANDWIDTH PRODUCT: 2 GHz (3 GHz for the NE73435)• SMALL COLLECTOR CAPACITANCE: 1 pF• HIGH RELIABILITY METALLIZATIONSpecifications SYMBOLS PARAMETERS UNITS RATING...

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NE734 Picture
SeekIC No. : 004433473 Detail

NE734: Features: • LOW NOISE FIGURE: < 3 dB at 500 MHz• HIGH GAIN: 15 dB at 500 MHz• HIGH GAIN BANDWIDTH PRODUCT: 2 GHz (3 GHz for the NE73435)• SMALL COLLECTOR CAPACITANCE: 1 pF...

floor Price/Ceiling Price

Part Number:
NE734
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/8

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Product Details

Description



Features:

• LOW NOISE FIGURE: < 3 dB at 500 MHz
• HIGH GAIN: 15 dB at 500 MHz
• HIGH GAIN BANDWIDTH PRODUCT: 2 GHz (3 GHz for the NE73435)
• SMALL COLLECTOR CAPACITANCE: 1 pF
• HIGH RELIABILITY METALLIZATION



Specifications

SYMBOLS
PARAMETERS
UNITS
RATINGS
VCEO
Collector to Emitter Voltage
V

30

VCBO
Collector to Base Voltage
V
14
VEBO
Emitter to Base Voltage
V
3
IC
Collector Current
mA
50
Tj
Junction Temperature
°C
2002
TSTG
Storage Temperature
°C
-65 to +2003
Notes:
1. Operation in excess of any one of these parameters may result in permanent damage.
2. Maximum Junction Temperature for the NE73430 is 150°C.
3. Maximum Storage Temperature for the NE73430 and the NE73435 Grade D is 150°C.



Description

The NE734 series of NPN silicon general purpose UHF transistors provide the designer with a wide selection of reliable transistors for high speed logic and wide-band low noise amplifier applications. The series uses NEC's NE734 highly reliable platinum-silicide, titanium, platinum, and gold metallization system to assure uniform performance and reliability.

TheNE73433 is in the plastic Mini-Mold package designed for high-speed automated assembly operations for large volume hybrid ICs. For hybrid MIC applications requiring more performance, the NE73435 is recommended. This device is packaged in the economical metal-ceramic, hermetic Micro-X package.




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