NBB-300

Features: ` Reliable, Low-Cost HBT Design` 12.0dB Gain, +13.8dBm P1dB@2GHz` High P1dB of+14.3dBm@6.0GHz and+11.2dBm@14.0GHz` Single Power Supply Operation` 50 I/O Matched for High Freq. UseApplication· Narrow and Broadband Commercial and Military Radio Designs· Linear and Saturated Amplifiers· Gai...

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NBB-300 Picture
SeekIC No. : 004432725 Detail

NBB-300: Features: ` Reliable, Low-Cost HBT Design` 12.0dB Gain, +13.8dBm P1dB@2GHz` High P1dB of+14.3dBm@6.0GHz and+11.2dBm@14.0GHz` Single Power Supply Operation` 50 I/O Matched for High Freq. UseApplicati...

floor Price/Ceiling Price

Part Number:
NBB-300
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

` Reliable, Low-Cost HBT Design
` 12.0dB Gain, +13.8dBm P1dB@2GHz
` High P1dB of
+14.3dBm@6.0GHz and
+11.2dBm@14.0GHz
` Single Power Supply Operation
` 50 I/O Matched for High Freq. Use





Application

· Narrow and Broadband Commercial and Military Radio Designs
· Linear and Saturated Amplifiers
· Gain Stage or Driver Amplifiers for MWRadio/Optical Designs (PTP/PMP/ LMDS/UNII/VSAT/WLAN/Cellular/ DWDM)





Specifications

Parameter
Rating
Unit
RF Input Power
+20
dBm
Power Dissipation
300
mW
Device Current
70
mA
Channel Temperature
200
Operating Temperature
-45 to +85
Storage Temperature
-65 to +150
Exceeding any one or a combination of these limits may cause
permanent damage.




Description

The NBB-300 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost, high-performance solution for general purpose RF and microwave amplification needs. This 50 gain block is based on a reliable HBT proprietary MMIC design, providing unsurpassed performance for small-signal applications. Designed with an external bias resistor, the NBB-300 provides flexibility and stability. The NBB-300 is packaged in a low-cost, surface-mount ceramic package, providing ease of assembly for high-volume tape-and-reel requirements. It is available in either packaged or chip (NBB-300-D) form, where its gold metallization is ideal for hybrid circuit designs.surface-mount ceramic package, providing ease of assembly for high-volume tape-and-reel requirements. It is available in either packaged or chip (NBB- 300-D) form, where its gold metallization is ideal for hybrid circuit designs.






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