MXP415-C

Features: • Light Activated Photo Transistor Chip• Planar NPN• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or Epoxy

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MXP415-C Picture
SeekIC No. : 004432028 Detail

MXP415-C: Features: • Light Activated Photo Transistor Chip• Planar NPN• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or Epoxy

floor Price/Ceiling Price

Part Number:
MXP415-C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/26

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Product Details

Description



Features:

• Light Activated Photo Transistor Chip
• Planar NPN
• Aluminum Wire bondable
• Backside Metallization - Gold
• Die Attach methods: Eutectic or Epoxy



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