Features: • Light Activated Photo Transistor Chip• Planar NPN• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or Epoxy
MXP415-C: Features: • Light Activated Photo Transistor Chip• Planar NPN• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or Epoxy
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Features: ·High Responsivity·Low Dark Current·Extremely Low Capacitance·12GHz , High Bandwidth·Cus...