Features: • Dielectrically Isolated Diodes• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or EpoxySpecifications SYMBOL CHARACTERISTIC CONDITIONS MIN TYP MAX UNITS VOC Open Circuit Voltage 10 mW/cm2, wavelength = 850 nm ...
MXP22-C: Features: • Dielectrically Isolated Diodes• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or EpoxySpecifications SYMBOL CHARACTERI...
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SYMBOL | CHARACTERISTIC | CONDITIONS | MIN | TYP | MAX | UNITS |
VOC | Open Circuit Voltage | 10 mW/cm2, wavelength = 850 nm | 10 | Volts | ||
ISC | Short Circuit Current | 10 mW/cm2, wavelength = 850 nm | 3.5 | uA | ||
VB | Reverse Breakdown Voltage | IR = 10 uA | 20 | Volts |