Features: • Dielectrically Isolated Diodes• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or EpoxySpecifications SYMBOL CHARACTERISTIC CONDITIONS MIN TYP MAX UNITS VOC Open Circuit Voltage 10 mW/cm2, wavelength = 850 n...
MXP18-C: Features: • Dielectrically Isolated Diodes• Aluminum Wire bondable• Backside Metallization - Gold• Die Attach methods: Eutectic or EpoxySpecifications SYMBOL CHARACTE...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Features: • Low Dark Current• Low Noise• High Break Down Voltage• Fast Ris...
Features: • Low Dark Current• Low Noise• High Break Down Voltage• Fast Ris...
SYMBOL | CHARACTERISTIC | CONDITIONS | MIN | TYP | MAX | UNITS |
VOC | Open Circuit Voltage | 10 mW/cm2, wavelength = 850 nm | 9.5 | Volts | ||
ISC | Short Circuit Current | 10 mW/cm2, wavelength = 850 nm | 3 | uA | ||
VB | Reverse Breakdown Voltage | IR = 10 uA | 20 | Volts |