MXP1156

Features: • Small size for hybrid assembly• 1,500 Vdc electrical isolation• Available in package form or ceramic substrateDescriptionThe MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to d...

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SeekIC No. : 004432020 Detail

MXP1156: Features: • Small size for hybrid assembly• 1,500 Vdc electrical isolation• Available in package form or ceramic substrateDescriptionThe MXP1156 series consists of a light emmittin...

floor Price/Ceiling Price

Part Number:
MXP1156
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

• Small size for hybrid assembly
• 1,500 Vdc electrical isolation
• Available in package form or ceramic substrate



Description

The MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to drive MOS devices.

MXP1156H - chip on ceramic substrate for Hybrid applications.

MXP1156 - standard TO-18 package.




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