Features: • Small size for hybrid assembly• 1,500 Vdc electrical isolation• Available in package form or ceramic substrateDescriptionThe MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to d...
MXP1156: Features: • Small size for hybrid assembly• 1,500 Vdc electrical isolation• Available in package form or ceramic substrateDescriptionThe MXP1156 series consists of a light emmittin...
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Features: • Low Dark Current• Low Noise• High Break Down Voltage• Fast Ris...
Features: • Low Dark Current• Low Noise• High Break Down Voltage• Fast Ris...
The MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to drive MOS devices.
MXP1156H - chip on ceramic substrate for Hybrid applications.
MXP1156 - standard TO-18 package.