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MXP1152

Features: ·Small size·Gold thick film bonding pads ·Custom input and output versions ·Low input current operationApplication·Solid state relays·Switching power supplies·CMOS drivers·Light metersSpecifications SYMBOL CHARACTERISTIC CONDITIONS MIN TYP MAX UNITS CTR Current Transfer ...

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SeekIC No. : 004432019 Detail

MXP1152: Features: ·Small size·Gold thick film bonding pads ·Custom input and output versions ·Low input current operationApplication·Solid state relays·Switching power supplies·CMOS drivers·Light metersSpec...

MXP1152 Data Sheet

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Part Number:
MXP1152
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Small size
·Gold thick film bonding pads
·Custom input and output versions
·Low input current operation


Application

·Solid state relays
·Switching power supplies
·CMOS drivers
·Light meters


Specifications

SYMBOL CHARACTERISTIC CONDITIONS MIN TYP MAX UNITS
CTR Current Transfer Ratio IF = 10 mA, VCE = 5.0 V 50 100   %
VCE(SAT) Collector-Emitter Saturation Voltage IF = 10 mA, IC = 1.0 mA   0.25   Volts
BVCEO Collector-Emitter Voltage IC = 100 uA 20     Volts
ICEO Collector-Emitter Leakage Current VCE = 20 V     100 nAmps
VF Input Forward Voltage IF = 10 mA 0.85 1.2 1.95 Volts
IR Input Reverse Current VR = 3.0 V     100 uAmps
T(on) Turn-On Time IF = 20 mA, VCE = 5 V,
RL = 100 Ohms		     30 usec



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