MXP1018-C

Features: • Light Activated Photo SCR• Planar PNPN• High Voltage• Cathode and Gate pads are Aluminum Wire bondable• Anode is backside of die• Backside metallization - Gold• Die Attach methods: eutectic or epoxySpecifications SYMBOL CHARACTERISTIC CO...

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MXP1018-C Picture
SeekIC No. : 004431984 Detail

MXP1018-C: Features: • Light Activated Photo SCR• Planar PNPN• High Voltage• Cathode and Gate pads are Aluminum Wire bondable• Anode is backside of die• Backside metallizati...

floor Price/Ceiling Price

Part Number:
MXP1018-C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/26

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Product Details

Description



Features:

• Light Activated Photo SCR
• Planar PNPN
• High Voltage
• Cathode and Gate pads are Aluminum Wire bondable
• Anode is backside of die
• Backside metallization - Gold
• Die Attach methods: eutectic or epoxy



Specifications

SYMBOL CHARACTERISTIC CONDITIONS IMN TYP MAX UNITS
VDM Off-State Voltage 660 Volts
VRM Reverse Voltage 550 Volts
IDM Off-State Leakage Current 0.2 uAmps
IRM Reverse Leakage 0.5 uAmps
IGT Gate Trigger Current 1.3 uAmps
IH Holding Current 40 uAmps
tON Turn-On Time 5 useconds



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