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MTSM5100LA-UO

Features: • Industry standard footprint• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder processes• Long life solid state reliability• IC Compatible• JEDEC Precondition Stress Tested• Also Available in ...

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SeekIC No. : 004430907 Detail

MTSM5100LA-UO: Features: • Industry standard footprint• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder processes• Long life solid stat...

MTSM5100LA-UO Data Sheet

floor Price/Ceiling Price

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Part Number:
MTSM5100LA-UO
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

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Upload time: 2024/11/26

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Product Details

Description



Features:

• Industry standard footprint
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder processes
• Long life solid state reliability
• IC Compatible
• JEDEC Precondition Stress Tested
• Also Available in Water Clear Package




Specifications

PART NO.
FORWARD
CURRENT(IF)
(mA)
REVERSE
VOLTAGE (VR)
(V)
POWER
DISSIPATION (PD)
(mW)
OPERATING
TEMPERATURE (Topr)
(°C)
STORAGE
TEMPERATURE (Tstg)
(°C)
MTSM5100LA-G
MTSM5100L-UY
MTSM5100LA-UA
MTSM5100LA-UO
MTSM5100LA-UR
MTSM5100L-UG
MTSM5100LB-UR
MTSM5100LA-UBL
MTSM5100LA-UV
MTSM5100LA-WT
30
30
30
30
30
30
30
30
30
30
5
4
4
4
4
4
4
5
5
5
70
85
85
85
70
85
85
70
70
70
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+85
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100
-30~+100



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