Features: • Industry standard footprint• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder processes• Long life solid state reliability• IC Compatible• JEDEC Precondition Stress Tested• Also Available in ...
MTSM5100LA-UA: Features: • Industry standard footprint• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder processes• Long life solid stat...
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Features: • Excellent on/off contrasts• Wide viewing angle• Solid state reliabil...
• Industry standard footprint
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder processes
• Long life solid state reliability
• IC Compatible
• JEDEC Precondition Stress Tested
• Also Available in Water Clear Package
PART NO. |
FORWARD CURRENT(IF) (mA) |
REVERSE VOLTAGE (VR) (V) |
POWER DISSIPATION (PD) (mW) |
OPERATING TEMPERATURE (Topr) (°C) |
STORAGE TEMPERATURE (Tstg) (°C) |
MTSM5100LA-G MTSM5100L-UY MTSM5100LA-UA MTSM5100LA-UO MTSM5100LA-UR MTSM5100L-UG MTSM5100LB-UR MTSM5100LA-UBL MTSM5100LA-UV MTSM5100LA-WT |
30 30 30 30 30 30 30 30 30 30 |
5 4 4 4 4 4 4 5 5 5 |
70 85 85 85 70 85 85 70 70 70 |
-30~+85 -30~+85 -30~+85 -30~+85 -30~+85 -30~+85 -30~+85 -30~+85 -30~+85 -30~+85 |
-30~+100 -30~+100 -30~+100 -30~+100 -30~+100 -30~+100 -30~+100 -30~+100 -30~+100 -30~+100 |