MTSF3N02HD

Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low Profile (<1.1mm) for thin applications such as PCMCIA cards• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life• Logic Level Gate Drive - Can Be Driven by Logic ICs&#...

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SeekIC No. : 004430885 Detail

MTSF3N02HD: Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low Profile (<1.1mm) for thin applications such as PCMCIA cards• Ultra Low RDS(on) Provides Hig...

floor Price/Ceiling Price

Part Number:
MTSF3N02HD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

• Miniature Micro8 Surface Mount Package - Saves Board Space
• Extremely Low Profile (<1.1mm) for thin applications such as PCMCIA cards
• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive - Can Be Driven by Logic ICs
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• IDSS Specified at Elevated Temperature
• Avalanche Energy Specified
• Mounting Information for Micro8 Package Provided



Pinout

  Connection Diagram


Specifications

Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
20
V
DraintoGate Voltage (RGS = 1.0 M)
VDGR
20
V
GatetoSource Voltage - Continuous
VGS
± 8.0
V
1 inch SQ.
FR4 or G10 PCB
Figure 1 below


Steady State
Thermal Resistance - Junction to Ambient
Total Power Dissipation @ TA = 25°C
Linear Derating Factor
Drain Current - Continuous @ TA = 25°C
Continuous @ TA = 70°C
Pulsed Drain Current (1)
RTHJA
PD

ID
ID
IDM
70
1.79
14.29
6.1
4.9
49
°C/W
Watts
mW/°C
A
A
A
Minimum
FR4 or G10 PCB
Figure 2 below


Steady State
Thermal Resistance - Junction to Ambient
Total Power Dissipation @ TA = 25°C
Linear Derating Factor
Drain Current - Continuous @ TA = 25°C
Continuous @ TA = 70°C
Pulsed Drain Current (1)
RTHJA
PD

ID
ID
IDM
160
0.78
6.25
4.0
3.2
32
°C/W
Watts
mW/°C
A
A
A
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
(1) Repetitive rating; pulse width limited by maximum junction temperature.


Description

MTSF3N02HD is an advanced series of power MOSFETs which utilize Motorola's High Cell Density HDTMOS process to achieve lowest possible onresistance per silicon area. The MTSF3N02HD is capable of withstanding high energy in the avalanche and commutation modes and the draintosource diode has a very low reverse recovery time. MTSF3N02HD is designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dcdc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. The MTSF3N02HD can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients.


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