MOSFET DISC BY MFG 2/02
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Features: • Avalanche Energy Specified• SourcetoDrain Diode Recovery Time Comparable t...
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
60 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
60 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 20 ± 25 |
Vdc VPK |
Drain Current - Continuous @ 25°C - Continuous@ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
42 30 147 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
125 0.83 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 175 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =25 Vdc, VGS = 10Vdc, PEAK IL =42 Apk, L =0.454H, RG = 25) |
EAS |
400 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
1.2 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |
MTP50N06V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Just as with our TMOS EFET designs, MTP50N06V is designed to withstand high energy in the avalanche and commutation modes. Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, the MTP50N06V is particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.