MSP30X12X2

`Low Supply Voltage Range 1.8 V - 3.6 V Ultralow-Power Consumption:
   -  Active Mode: 200 A at 1 MHz, 2.2 V
   -  Standby Mode: 0.7 A
   -  Off Mode (RAM Retention): 0.1 A Five Power Saving Modes
`Wake-Up From Standby Mode in less than 6 s
`16-Bit RISC Architecture, 125 ns Instruction Cycle Time
`Basic Clock Module Configurations:
   -  Various Internal Resistors
   -  Single External Resistor
   -  32-kHz Crystal
   -  High Frequency Crystal
   -  Resonator
   -  External Clock Source 16-Bit Timer_A With Three Capture/Compare Registers
`10-Bit, 200-ksps A/D Converter With Internal Reference, Sample-and-Hold, Autoscan, and Data Transfer Controller
`Serial Communication Interface (USART0) With Software-Selectable Asynchronous UART or Synchronous SPI (MSP430x12x2 Only)
`Serial Onboard Programming, No External Programming Voltage Needed Programmable Code Protection by Security Fuse
`Supply Voltage Brownout Protection MSP430x11x2 Family Members Include:
   MSP430F1122: 4KB + 256B Flash Memory 256B RAM
   MSP430F1132: 8KB + 256B Flash Memory 256B RAM
   Available in 20-Pin Plastic SOWB, 20-Pin
   Plastic TSSOP and 32-Pin QFN Packages MSP430x12x2
`Family Members Include:
   MSP430F1222: 4KB + 256B Flash Memory 256B RAM
   MSP430F1232: 8KB + 256B Flash Memory 256B RAM
   Available in 28-Pin Plastic SOWB, 28-Pin Plastic TSSOP, and 32-Pin QFN Packages
`For Complete Module Descriptions, See the MSP430x1xx Family User's Guide, Literature Number SLAU049

Voltage applied at V_CC  to V_SS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 4.1 V
Voltage applied to any pin (see Note)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  .3 V to V_CC  + 0.3 V
Diode current at any device terminal  .  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  ±2 mA
Storage temperature, T_stg  (unprogrammed device)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  -55 to 150
Storage temperature, T_stg (programmed device)  . . . . .  . . . . . . .  . . . . . . . . . . . . . . . . . . . .  . .  -40 to 85
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE: All voltages referenced to V_SS . The JTAG fuse-blow voltage, V_FB , is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse.

The Texas Instruments MSP30X12X2ultralow-power microcontrollers consist of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low power modes is optimized to achieve extended battery life in portable measurement applications. The MSP30X12X2 features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that attribute to maximum code efficiency.

The digitally controlled oscillator (DCO) of MSP30X12X2 allows wake-up from low-power modes to active mode in less than 6s.

The MSP30X12X2 are ultralow-power mixed signal microcontrollers with a built-in 16-bit timer, 10-bit A/D converter with integrated reference and data transfer controller (DTC) and fourteen or twenty-two I/O pins. In addition, the MSP430x12x2 series microcontrollers have built-in communication capability using asynchronous (UART) and synchronous (SPI) protocols.

Digital signal processing of MSP30X12X2 with the 16-bit RISC performance enables effective system solutions such as glass breakage detection with signal analysis (including wave digital filter algorithm). Another area of application is in stand-alone RF sensors.