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MSC23409C

Features: • 4-Meg × 9-bit organization• 30-Pin Socket Insertable Module MSC23409C/CL-xxDS9 : Solder tab• Single 5 V supply ±10% tolerance• Access times : 60, 70, 80 ns• Input : TTL compatible• Output : TTL compatible, 3-state• Refresh : 1024 cycles/16 ms (...

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SeekIC No. : 004427874 Detail

MSC23409C: Features: • 4-Meg × 9-bit organization• 30-Pin Socket Insertable Module MSC23409C/CL-xxDS9 : Solder tab• Single 5 V supply ±10% tolerance• Access times : 60, 70, 80 ns•...

MSC23409C Data Sheet

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Part Number:
MSC23409C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 4-Meg × 9-bit organization
• 30-Pin Socket Insertable Module
MSC23409C/CL-xxDS9 : Solder tab
• Single 5 V supply ±10% tolerance
• Access times : 60, 70, 80 ns
• Input : TTL compatible
• Output : TTL compatible, 3-state
• Refresh : 1024 cycles/16 ms (128 ms : L-version)
• CAS before RAS refresh, CAS before RAS hidden refresh, RAS-only refresh capability
• Multi-bit test mode capability
• Fast Page Mode capability


Specifications

Parameter

 Symbol Rating Unit
Voltage on Any Pin Relative to VSS VIN, VOUT 1.0 to 7.0 V
Voltage VCC Supply Relative to VSS VCC 1.0 to 7.0 V
Short Circuit Output Current IOS 50 mA
Power Dissipation PD 9 W
Operating Temperature Topr 0 to 70 °C
Storage Temperature Tstg 40 to 125 °C
Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
          exceeded. Functional operation should be restricted to the conditions as detailed in the
          operational sections of this data sheet. Exposure to absolute maximum rating conditions
          for extended periods may affect device reliability.


Description

The OKI MSC23409C/CL-xxDS9 is a fully decoded 4,194,304-word × 9-bit CMOS Dynamic Random Access Memory Module composed of nine 4-Mb DRAMs (4M ×1) in SOJ packages mounted with nine decoupling capacitors on a 30-pin glass epoxy single-inline package. This module is generally used for memory expansion in parity applications such as workstations. The low-power version (CL) offers reduced power consumption for mobile computing applications like laptops and palmtops.




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