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MSC23137D-xxDS9

Features: · 1,048,576-word x 36-bit organization· 72-pin socket insertable module - MSC23137D-xxBS9 : Gold tab - MSC23137D-xxDS9 : Solder tab· Single +5V supply ± 10% tolerance· Input : TTL compatible· Output : TTL compatible, 3-state· Refresh : 1024cycles/16ms· /CAS before /RAS refresh, hidden re...

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SeekIC No. : 004427853 Detail

MSC23137D-xxDS9: Features: · 1,048,576-word x 36-bit organization· 72-pin socket insertable module - MSC23137D-xxBS9 : Gold tab - MSC23137D-xxDS9 : Solder tab· Single +5V supply ± 10% tolerance· Input : TTL compatib...

MSC23137D-xxDS9 Data Sheet

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Part Number:
MSC23137D-xxDS9
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

· 1,048,576-word x 36-bit organization
· 72-pin socket insertable module
  - MSC23137D-xxBS9 : Gold tab
  - MSC23137D-xxDS9 : Solder tab
· Single +5V supply ± 10% tolerance
· Input : TTL compatible
· Output : TTL compatible, 3-state
· Refresh : 1024cycles/16ms
· /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability
· Fast page mode capability
· Multi-bit test mode capability


Specifications

Item Symbol Ratings Unit
Voltage on any pin relative to Vss VIN,VOUT -1.0 to +7.0 V
Voltage on VCC Supply Relative to VSS Vcc -1.0 to +7.0 V
Short circuit current IOS 50 mA
Power dissipation PD 9 W
Operating temperature Topr 0 to 70 °C
Storage temperature Tstg - 40 to 125 °C

*: Ta=25°C




Description

The MSC23137D-xxBS9/MSC23137D-xxDS9 is a fully decoded, 1,048,576-word x 36-bit CMOS dynamic random access memory module composed of nine 4Mb DRAMs in SOJ packages mounted with nine decoupling capacitors on a 72-pin glass epoxy single-inline package. This module supports any application where high density and large capacity of storage memory are required.




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