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MS2215

Features: · REFRACTORY/GOLD METALLIZATION· EMITTER SITE BALLASTED· LOW THERMAL RESISTANCE· INPUT/OUTPUT MATCHING· OVERLAY GEOMETRY· METAL/CERAMIC HERMETIC PACKAGE· POUT = 150 W MIN. WITH 7.5 dB GainPinoutSpecifications Symbol Parameter Value Unit PDISS Power Dissipation * (TC °...

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SeekIC No. : 004427272 Detail

MS2215: Features: · REFRACTORY/GOLD METALLIZATION· EMITTER SITE BALLASTED· LOW THERMAL RESISTANCE· INPUT/OUTPUT MATCHING· OVERLAY GEOMETRY· METAL/CERAMIC HERMETIC PACKAGE· POUT = 150 W MIN. WITH 7.5 dB Gain...

MS2215 Data Sheet

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Part Number:
MS2215
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·  REFRACTORY/GOLD METALLIZATION
·  EMITTER SITE BALLASTED
·  LOW THERMAL RESISTANCE
·  INPUT/OUTPUT MATCHING
·  OVERLAY GEOMETRY
·  METAL/CERAMIC HERMETIC PACKAGE
·  POUT = 150 W MIN. WITH 7.5 dB Gain




Pinout

Connection Diagram


Specifications

Symbol
 Parameter
Value
Unit
PDISS
 Power Dissipation * (TC °C)
300
IC
 Device Current *
16.5
A
VCC
 Collector - Supply Voltage *
35
V
TJ
 Junction Temperature (Pulsed RF Operation)
250
°C
TSTG
 Storage Temperature *
- 65 to + 200
°C



Description

The MS2215 is designed for specialized avionics applications, including Mode-S, TCAS and JTIDS where power is provided under pulse formats utilizing short pulse widths and high burst or overall duty cycles.

 




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