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MP6301

Application`Small package by full molding (SIP 12 pin)`High collector power dissipation (6 devices operation) : PT = 4.4 W (Ta = 25)`High collector current: IC (DC) = ±3 A (max)` High DC current gain: hFE = 2000 (min) (VCE = ±2 V, IC = ±1 A)Specifications Characteristics Symbol Rating ...

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MP6301: Application`Small package by full molding (SIP 12 pin)`High collector power dissipation (6 devices operation) : PT = 4.4 W (Ta = 25)`High collector current: IC (DC) = ±3 A (max)` High DC current gai...

MP6301 Data Sheet

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Part Number:
MP6301
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Application

 `Small package by full molding (SIP 12 pin)
 `High collector power dissipation (6 devices operation)  : PT = 4.4 W (Ta = 25)
 `High collector current: IC (DC) = ±3 A (max)
 ` High DC current gain: hFE = 2000 (min) (VCE = ±2 V, IC = ±1 A)


Specifications

Characteristics
Symbol
Rating
Unit
NPN
PNP
Collector-base voltage
VCBO
100
−100
V
Collector-emitter voltage
VCEO
80
−80
V
Emitter-base voltage
VEBO
8
−8
V
Collector current DC
IC
3
-3
A
Pulse
ICP
5
-5
Continuous base current
IB
0.5
-0.5
A
Collector power dissipation
1 device operation)
PC
2.0
-2.0
W
Collector power dissipation
(6 devices operation)
PT
4.4
W
Junction temperature
Tj
150
Storage temperature range
Tstg
−55 to 150



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