MP1208

DescriptionThe MP1208 is a kind of 12-bit D/A converter with an 8/4 bit latched interface that provide maximum flexibility in interfacing to P data bus. All data loading and data transfer operations are identical to the WRITE cycle of a static RAM. The MP1208 incorporates a unique bit decoding tec...

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SeekIC No. : 004425429 Detail

MP1208: DescriptionThe MP1208 is a kind of 12-bit D/A converter with an 8/4 bit latched interface that provide maximum flexibility in interfacing to P data bus. All data loading and data transfer operations...

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Part Number:
MP1208
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Description

The MP1208 is a kind of 12-bit D/A converter with an 8/4 bit latched interface that provide maximum flexibility in interfacing to P data bus. All data loading and data transfer operations are identical to the WRITE cycle of a static RAM. The MP1208 incorporates a unique bit decoding technique yielding low glitch, higher speed and excellent accuracy over temperature and time.

There are some features of MP1208 as follows: (1)low data bus feedthrough @ CS=1; (2)stable, more accurate segmented DAC approach; (3)ultra stable: 0.2 ppm/ linearity tempco and 2 ppm/ max gain error tempco; (4)low sensitivity to amplifier VOS; (5)low output capacitance; (6)COUT1=80 pF at full scale, gives fastest setting times, and larger stable bandwidth capability; (7)lower glitch energy; (8)four quadrant multiplication; (9)all parts guaranteed 12-bit monolithic; (10)low feedthrough error; (11)low power consumption; (12)TTL/CMOS compatible; (13)latch-up free; (14)-55 to +125 operation.

The following is about the absolute maximum ratings of MP1208 (Ta=25 unless otherwised noted): (1)VDD to GND: 0 to +17 V; (2)digital input voltage to GND: GND-0.5 to VDD+0.5 V; (3)VREF to GND: ±25 V; (4)VRFB to GND: ±25 V; (5)AGND to DGND: ±1 V (functionality guaranteed ±0.5 V); (6)storage temperature: -65 to 150; (7)lead temperature (soldering, 10 sec): 300; (8)package power dissipation (75): 1150 mW (CDIP, PDIP).




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