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MP1004

Features: · Diffused Junction· High Current Capability· High Case Dielectric Strength· High Surge Current Capability· Ideal for Printed Circuit Board Application · Plastic Material has Underwriters Laboratory Flammability Classification 94V-OSpecifications Characteristic Symbol MP1000 ...

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SeekIC No. : 004425405 Detail

MP1004: Features: · Diffused Junction· High Current Capability· High Case Dielectric Strength· High Surge Current Capability· Ideal for Printed Circuit Board Application · Plastic Material has Underwriters ...

MP1004 Data Sheet

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Part Number:
MP1004
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

· Diffused Junction
· High Current Capability
· High Case Dielectric Strength
· High Surge Current Capability
· Ideal for Printed Circuit Board Application
· Plastic Material has Underwriters Laboratory Flammability Classification 94V-O




Specifications

Characteristic
Symbol
MP
1000
MP
1001
MP
1002
MP
1004
MP
1006
MP
1008
MP
1010
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
 50 100 200 400 600 800 1000
V
RMS Reverse Voltage
VR(RMS)
 35 70 140 280 420 560 700
V
Average Rectified Output Current(Note 1) @TA = 50
IO
10
A
Non-Repetitive Peak Forward Surge Current
8.3 mS single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
100
A
Forward Voltage (per Element) @IF = 5.0A
VFM
1.1
V
Peak Reverse Current @TC = 25
At Rated DC Blocking Voltage @TC = 100
IR
10
1.0
A
mA
I2t Rating for Fusing (t<8.3ms) (Note 2)
I2t
64
A2s
Typical Junction Capacitance (Note 3)
Cj
110
pF
Typical Thermal Resistance (Note 4)
RJC
7.5
K/W
Operating and Storage Temperature Range
Tj ,TSTG
-65 to +125
Note: 1. Non-repetitive for t > 1ms and < 8.3ms.
2. Thermal resistance junction to ambient mounted on PC board with 13.0 x 13.0 x 0.03mm thick land areas.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
4. Thermal resistance junction to case per element.




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