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MP04TT600

Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (Non Toxic) Isolation Medium· Integral Water Cooled HeatsinkApplication· Motor Control· Controlled Rectifier Bridges· Heater Control· AC Phase ControlSpecificatio...

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SeekIC No. : 004425390 Detail

MP04TT600: Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (Non Toxic) Isolation Medium· Integral Water Cooled HeatsinkAp...

MP04TT600 Data Sheet

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Part Number:
MP04TT600
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·  Dual Device Module
·  Electrically Isolated Package
·  Pressure Contact Construction
·  International Standard Footprint
·  Alumina (Non Toxic) Isolation Medium
·  Integral Water Cooled Heatsink


Application

·  Motor Control
·  Controlled Rectifier Bridges
·  Heater Control
·  AC Phase Control


Specifications

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol Parameter Test Conditions
Max.
Units
IT(AV) Mean on-state current Half wave resistive load,
4.5 Ltr/min		 Twater (in) = 25
650
A
Twater (in) = 40
580
A
IT(RMS) RMS value Twater (in) = 25 @ 4.5 Ltr/min
1020
A
Twater (in) = 40 @ 4.5 Ltr/min
912
A
ITSM Surge (non-repetitive) on-current 10ms half sine, Tj = 125
VR = 0
4
kA
I2t I2t for fusing
0.975 x 106
A2s
ITSM Surge (non-repetitive) on-current 10ms half sine, Tj = 125
VR = 50% VDRM
11.2
kA
I2t I2t for fusing
0.6251 x 106
A2s
Visol Isolation voltage Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
3000
V



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