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MP02X130

Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (non-toxic) Isolation MediumApplication· Motor Control· Controlled Rectifier Bridges· Heater Control· AC Phase ControlSpecificationsStresses above those listed un...

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SeekIC No. : 004425357 Detail

MP02X130: Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (non-toxic) Isolation MediumApplication· Motor Control· Contro...

MP02X130 Data Sheet

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Part Number:
MP02X130
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  Dual Device Module
·  Electrically Isolated Package
·  Pressure Contact Construction
·  International Standard Footprint
·  Alumina (non-toxic) Isolation Medium


Application

·  Motor Control
·  Controlled Rectifier Bridges
·  Heater Control
·  AC Phase Control


Specifications

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol Parameter Test Conditions
Max.
Units
IT(AV) Mean on-state current Half wave resistive load
 Tcase = 75
134
A
Tcase = 85
112
A
IT(RMS) RMS value Tcase = 75
210
A
ITSM Surge (non-repetitive) on-current
10ms half sine, Tj = 125
VR = 0
4.0
kA
I2t I2t for fusing
80 x 103
A2s
ITSM Surge (non-repetitive) on-current
10ms half sine, Tj = 125
VR = 50% VDRM
3.2
kA
I2t I2t for fusing
51.2 x 103
A2s
Visol Isolation voltage Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
3000
V



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