Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (Non Toxic) Isolation Medium· Integral Water Cooled HeatsinkApplication· Motor Control· Controlled Rectifier Bridges· Heater Control· AC Phase ControlSpecificatio...
MP02TT200: Features: · Dual Device Module· Electrically Isolated Package· Pressure Contact Construction· International Standard Footprint· Alumina (Non Toxic) Isolation Medium· Integral Water Cooled HeatsinkAp...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol | Parameter | Test Conditions |
Max. |
Units | |
IT(AV) | Mean on-state current | Half wave resistive load, 4.5 Ltr/min |
Twater (in) = 25 |
230 |
A |
Twater (in) = 40 |
200 |
A | |||
Twater (in) = 50 |
180 |
A | |||
IT(RMS) | RMS value | Twater (in) = 25 @ 4.5 Ltr/min |
360 |
A | |
Twater (in) = 40 @ 4.5 Ltr/min |
318 |
A | |||
ITSM | Surge (non-repetitive) on-current | 10ms half sine, Tj = 125 VR = 0 |
6.8 |
kV | |
I2t | I2t for fusing |
0.231 x 106 |
A2s | ||
ITSM | Surge (non-repetitive) on-current | 10ms half sine, Tj = 125 VR = 50% VDRM |
5.5 |
kA | |
I2t | I2t for fusing |
0.15 x 106 |
A2s | ||
Visol | Isolation voltage | Commoned terminals to base plate. AC RMS, 1 min, 50Hz |
3000 |
V |