MODEL 170

      BI's Custom Power Modules are designed to assemble all of your circuit's power components into one, easy to manage, package. BI offers power module designs that allow the module to be soldered to the circuit board at the same time as the other components, eliminating hand soldering operations. Power modules allow the use of a simpler and less expensive heat sink. All the power components of MODEL 170 normally bolted to the heat sink should be included in the custom module.
      MODEL 170 has following features and benefits. The 1st one is about low cost custom modules.The 2nd one is that it can reduce circuit size.The 3rd one is that it allows simplified heat sink.The 4th one is about soldering technique minimizes voids.The 5th one is that it is flexible package dimensions.
It can be applied to power supply subassemblies,motor driver,power amplifier,H-Bridge,bridge rectifier,ganged power FETs,and so on.
      The following is on its packaging of MODEL 170. Package size is custom packaging from 0.3" to 4.0" on a side.The typical package is heat sink attachment and heat transfer. Package configurations is about ceramic substrate, typically copper clad to promote heat transfer.Base with mounted components is assembled into a custom frame and encapsulated.
      Semiconductor components are BJTs, FETs, Diodes, SCRs and IGBTs. Capacitors are ceramic and tantalum. Other components of MODEL 170 are resistors, thermisters and various surface mount/solder mount components.