MODEL 143

      The MODEL 143 is a kind of custom commercial modules, which has the characteristices of low cost surface mount assembly, ceramic board, reduced board size, integral thick film resistors, chip on board capability, U.S. design & management, U.S. or offshore assembly, low profile outline and versatile lead configuration.
      The BI Technologies of MODEL 143 has the solution for you, Whether you are upgrading your "through-hole" circuit board to surface mount or developing a new design. BI commercial hybrids can encompass your entire circuit and can be used as subassemblies on motherboard. Hybrid assemblies are being used in an increasing number of applications, which are circuit boards based on ceramic material rather than conventional polymer materials. In small to mid-sized assemblies, ceramic substrates offer price competitive solutions and many quality and design advantages. Resistors are directly screened onto the substrate and other components are typically surface mounted. many a diffrent lead frame configurations are available to create SIP's, DIP's, through hole, and surface mountable assemblies. Polymer encapsulation can be used to protect components and proprietary designs. Chip and wire attachment is available for components where required.
      There is an experienced design team that provides customer assistance on new programs from the proposal/estimate phase through development and into production for the MODEL 143. During the development phase, a customer interface will be set up to develop and price alternate design approaches. While during the  phase, a close working arrangement will be maintained through prototype samples and into production. Simply submit a circuit schematic, dimensional constraints, critical components and any special requirements to BI Marketing. BI will produce a sizing estimate and costing workup to meet your design goals.