MOCD223

Features:

• Dual Channel Coupler
• Convenient Plastic SOIC8 Surface Mountable Package Style
• High Output Current (I_C) (500% min) @ 1 mA Input Current
• Minimum V_(BR)CEO of 30 Volts Guaranteed
• Standard SOIC8 Footprint, with 0.050, Lead Spacing
• Shipped in Tape and Reel, which conforms to EIA Standard RS481A
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High InputOutput Isolation of 3000 V_{ac (rms)} Guaranteed
• Meets U.L. Regulatory Requirements, File #E54915


Pinout




Specifications

Rating	Symbol	Value	Unit
INPUT LED
Forward Current - Continuous	IF	60	mA
Forward Current - Peak (PW = 100 s, 120 pps)	IF (pk)	1.0	A
Reverse Voltage	VR	6.0	V
LED Power Dissipation @ TA = 25°C Derate above 25°C	PD	90 0.8	mW mW/°C
OUTPUT TRANSISTOR
Collector-Emitter Voltage	VCEO	30	V
Collector-Base Voltage	VCBO	70	V
Emitter-Collector Voltage	VECO	7.0	V
Collector Current-Continuous	IC	150	mA
Detector Power Dissipation @ TA = 25°C Derate above 25°C	PD	150 1.76	mW mW/°C
TOTAL DEVICE
Input-Output Isolation Voltage (1,2,3) (f = 60 Hz, 1 min. Duration)	VISO	2500	Vac(rms)
Total Device Power Dissipation @ TA = 25°C Derate above 25°C	PD	250 2.94	mW mW/°C
Ambient Operating Temperature Range	TA	-55 to +100	°C
Storage Temperature Range	Tstg	-55 to +150	°C
Lead Soldering Temperature (1/16" from case, 10 sec. duration)	-	260	°C

Description

The MOCD223 device consists of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor darlington detectors, in a surface mountable, small outline, plastic package. MOCD223 is ideally suited for high density applications that require low input current and eliminates the need for throughtheboard mounting.