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MOC217

Features: • Convenient Plastic SOIC8 Surface Mountable Package Style• Low LED Input Current Required, for Easier Logic Interfacing• Standard SOIC8 Footprint, with 0.050, Lead Spacing• Shipped in Tape and Reel, which Conforms to EIA Standard RS481A• Compatible with Dua...

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SeekIC No. : 004425062 Detail

MOC217: Features: • Convenient Plastic SOIC8 Surface Mountable Package Style• Low LED Input Current Required, for Easier Logic Interfacing• Standard SOIC8 Footprint, with 0.050, Lead Spaci...

MOC217 Data Sheet

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Part Number:
MOC217
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Convenient Plastic SOIC8 Surface Mountable Package Style
• Low LED Input Current Required, for Easier Logic Interfacing
• Standard SOIC8 Footprint, with 0.050, Lead Spacing
• Shipped in Tape and Reel, which Conforms to EIA Standard RS481A
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High InputOutput Isolation of 3000 Vac (rms) Guaranteed
• UL Recognized File #E54915


Application

• Low power Logic Circuits
• Interfacing and coupling systems of different potentials and impedances
• Telecommunications equipment
• Portable electronics


Specifications

Rating
Symbol
Value
Unit
INPUT LED
Forward Current - Continuous
IF
60
mA
Forward Current - Peak (PW = 100 s, 120 pps)
IF(pk)
1.0
A
Reverse Voltage
VR
6.0
V
LED Power Dissipation @ TA = 25
Derate above 25
PD
90
0.8
mW
mW/
OUTPUT DARLINGTON
CollectorEmitter Voltage
VCEO
30
V
CollectorBase Voltage
VCBO
70
V
EmitterCollector Voltage
VECO
7.0
V
Collector Current - Continuous
IC
150
mA
Detector Power Dissipation @ TA = 25
Derate above 25
PD
150
1.76
mW
mW/
TOTAL DEVICE
InputOutput Isolation Voltage(1,2)
(60 Hz, 1.0 sec. duration)
VISO
3000
Vac(rms)
Total Device Power Dissipation @ TA = 25
Derate above 25
PD
250
2.94
mW
mW/
Ambient Operating Temperature Range(3)
TA
55 to +100
Storage Temperature Range(3)
Tstg
55 to +150
Lead Soldering Temperature (1/16" from case, 10 sec. duration)
-
260
NOTE: Thickness through insulation between input and output is 0.5 mm.


Description

These MOC217 devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. MOC217 are ideally suited for high density applications, and eliminate the need for throughtheboard mounting.




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