MMUN2233RL34

Features: ` Simplifies Circuit Design` Reduces Board Space` Reduces Component Count ` The SOT-23 package can be soldered using wave or reflow. The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die. ` Available in 8 mm embossed tape a...

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SeekIC No. : 004424512 Detail

MMUN2233RL34: Features: ` Simplifies Circuit Design` Reduces Board Space` Reduces Component Count ` The SOT-23 package can be soldered using wave or reflow. The modified gull-winged leads absorb thermal stress du...

floor Price/Ceiling Price

Part Number:
MMUN2233RL34
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/23

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Product Details

Description



Features:

` Simplifies Circuit Design
` Reduces Board Space
` Reduces Component Count
` The SOT-23 package can be soldered using wave or reflow. The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die.
` Available in 8 mm embossed tape and reel. Use the Device Number to order the 7 inch/3000 unit reel.

    Replace "T1" with "T3" in the Device Number to order the 13 inch/10,000 unit reel.




Specifications

Rating
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
Collector Current
IC
100
mAdc
Total Power Dissipation @ TA = 25(1)
Derate above 25
PD
200
1.6
mW
mW/



Description

This new MMUN2233RL34 series of digital transistors is designed to replace a single device  and  its external resistor bias network. The MMUN2233RL34 BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors;  a series  base resistor and a base-emitter resistor.The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SOT-23 package which is designed for low power surface mount applications.




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