MMSZ5259BS

Features: · Planar Die Construction· Ultra-Small Surface Mount Package· General Purpose· Ideally suited for Automated Assembly Processes· Lead Free /RoHS Compliant (Note 3)Specifications Part Number MMSZ5259BS Power Rating (mW) 200 NomVZ 39 @ IZT (mA) 3.2 Tol V (typ) (%) ...

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SeekIC No. : 004424469 Detail

MMSZ5259BS: Features: · Planar Die Construction· Ultra-Small Surface Mount Package· General Purpose· Ideally suited for Automated Assembly Processes· Lead Free /RoHS Compliant (Note 3)Specifications Part N...

floor Price/Ceiling Price

Part Number:
MMSZ5259BS
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

· Planar Die Construction
· Ultra-Small Surface Mount Package
· General Purpose
· Ideally suited for Automated Assembly Processes
· Lead Free /RoHS Compliant (Note 3)





Specifications

Part Number MMSZ5259BS
Power Rating (mW) 200
NomVZ 39
@ IZT (mA) 3.2
Tol V (typ) (%) 5
IR (µA) 0.1


Characteristic Symbol Value Unit
Forward Voltage (Note 2) @ IF = 10mA VF 0.9 V
Power Dissipation (Note 1) Pd 200 mW
Thermal Resistance, Junction to Ambient Air (Note 1) RJA 625 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C

Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.






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