Features: *Planar Die Construction *Dual Isolated Zeners in Ultra-Small Surface Mount Package *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit Forward Voltage @ IF = 10mA VF 0.9 V Power Dissipation (Note 1) PD 200 mW Ther...
MMBZ5257BS: Features: *Planar Die Construction *Dual Isolated Zeners in Ultra-Small Surface Mount Package *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit Fo...
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Parameter | Symbol | Value | Unit |
Forward Voltage @ IF = 10mA | VF | 0.9 | V |
Power Dissipation (Note 1) | PD | 200 | mW |
Thermal Resistance, Junction to Ambient (Note 1) | RJA | 625 | °C/W |
Operating and Storage Temperature Range | TJ, TSTG | -65~150 | °C |
Part Number | MMBZ5257BS |
Power Rating (mW) | 200 |
NomVZ | 33 |
@ IZT (mA) | 3.8 |
Tol V (typ) (%) | 5 |
IR (µA) | 0.1 |