Features: *Planar Die Construction *Dual Isolated Zeners in Ultra-Small Surface Mount Package *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit Forward Voltage @ IF = 10mA VF 0.9 V Power Dissipation (Note 1) PD 200 mW Ther...
MMBZ5227BS: Features: *Planar Die Construction *Dual Isolated Zeners in Ultra-Small Surface Mount Package *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit Fo...
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Parameter | Symbol | Value | Unit |
Forward Voltage @ IF = 10mA | VF | 0.9 | V |
Power Dissipation (Note 1) | PD | 200 | mW |
Thermal Resistance, Junction to Ambient (Note 1) | RJA | 625 | °C/W |
Operating and Storage Temperature Range | TJ, TSTG | -65~150 | °C |