Features: Voltage Supply-2.7 V ~3.6 VOrganization - Memory Cell Array -X8 device(K9F2G08X0M) : (256M + 8,192K)bit x 8bit -X16 device(K9F2G16X0M) : (128M + 4,096K)bit x 16bit - Data Register -X8 device(K9F2G08X0M): (2K + 64)bit x8bit -X16 device(K9F2G16X0M): (1K + 32)bit x16bit - Cache Register...
MK9F2G08U0M: Features: Voltage Supply-2.7 V ~3.6 VOrganization - Memory Cell Array -X8 device(K9F2G08X0M) : (256M + 8,192K)bit x 8bit -X16 device(K9F2G16X0M) : (128M + 4,096K)bit x 16bit - Data Register -X8 de...
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Parameter | Symbol | Rating | Unit | |
Voltage on any pin relative to VSS | VIN/OUT |
-0.6 to + 4.6 | V | |
VCC | -0.6 to + 4.6 | |||
TemperatureUnderBias | K9F2GXXU0M-XCB0 | TBIAS |
-10 to +125 |
°C |
K9F2GXXU0M-XIB0 | -40 to +125 | |||
Storage Temperature | K9F2GXXU0M-XCB0 | TSTG | -40 to +125 | °C |
K9F2GXXU0M-XIB0 | ||||
Short Circuit Current | Ios |
5 |
mA |
Offered in 256Mx8bit or 128Mx16bit, the K9F2GXXU0M is 2G bit with spare 64M bit capacity. Its NAND cell provides the most cost- effective solution for the solid state mass storage market. A program operation can be performed in typical 200s on the 2112- byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64K-word(X16 device) block. Data of K9F2GXXU0M in the data page can be read out at 30ns cycle time per byte(X8 device) or word(X16 device)..
The I/O pins of K9F2GXXU0M serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F2GXXU0Ms extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F2GXXU0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.