Features: ·Lead Formed for Surface Mount Applications in Plastic Sleeves·Pb-Free Packages are AvailableSpecifications SYMBOL PARAMETER RATING UNIT VCBO Collector to base voltageMJD31,MJD32 MJD31C,MJD32C 40100 V VCE Collector to emitter voltageMJD31,MJD32 MJD31C,MJD32C 40100 V ...
MJD31: Features: ·Lead Formed for Surface Mount Applications in Plastic Sleeves·Pb-Free Packages are AvailableSpecifications SYMBOL PARAMETER RATING UNIT VCBO Collector to base voltageMJD31,MJD...
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SYMBOL | PARAMETER | RATING | UNIT |
VCBO | Collector to base voltage MJD31,MJD32 MJD31C,MJD32C |
40 100 |
V |
VCE | Collector to emitter voltage MJD31,MJD32 MJD31C,MJD32C |
40 100 |
V |
VEB | Emitter to base voltage | 5 | V |
IC | Collector current | 3 | A |
ICP | Collector current (pulse) | 5 | A |
IB | base current | 1 | A |
PD | Total Device Dissipation FR-5 Board @TA = 25 Derate above 25 |
15 0.12 |
W W/ |
PD | Total Device Dissipation Alumina Substrate @TA = 25 Derate above 25 |
1.56 0.012 |
W W/ |
Tstg | Storage temperature | -65 to +150 | |
Tj | Junction temperature | 150 | |
RèJC | Thermal Resistance, Junction-to-Case | 8.3 | W/ |
RèJA | Thermal Resistance, Junction-to-Ambient | 80 | W/ |
TL | Lead Temperature for Soldering Purposes | 260 |