Features: ·Compact and thin·MIR-3301 : Compact DIP, long lead type·Optimum detecting diatance : 0.8 - 1.0 mm·Wavelength : 940nm·Visible light cut-off typeSpecifications Parameter Symbol Minimum Rating Maximum Rating Unit INPUT Continuous Forward Current LF 50 mA...
MIR-3301: Features: ·Compact and thin·MIR-3301 : Compact DIP, long lead type·Optimum detecting diatance : 0.8 - 1.0 mm·Wavelength : 940nm·Visible light cut-off typeSpecifications Parameter Symbol ...
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·Compact and thin
·MIR-3301 : Compact DIP, long lead type
·Optimum detecting diatance : 0.8 - 1.0 mm
·Wavelength : 940nm
·Visible light cut-off type
Parameter |
Symbol |
Minimum Rating |
Maximum Rating |
Unit | |
INPUT | Continuous Forward Current |
LF |
50 |
mA | |
Reverse Voltage |
VR |
5 |
V | ||
Power Dissipation |
Pad |
75 |
mW | ||
OUTPUT | Collector-emitter breakdown voltage |
V(BR)CEO |
30 |
V | |
Emitter-Collector breakdown voltage |
V(BR)ECO |
5 |
V | ||
Collector power dissipation |
PC |
75 |
mW | ||
Total power dissipation |
PTOT |
100 |
mW | ||
Operating Temperature Range |
Topr |
-25oC to + 85oC | |||
Storage Temperature Range |
TSTG |
-40oC to + 100oC | |||
Lead Soldering Temperature (within 5 sec, minimum 1.6mm from body) at 260oC |
The MIR-3301 consists of a Gallium Arsenide infrared emitting diode and a NPN silicon phototransistor built in a black plastic housing. It is a reflective subminiature photointerrupter.