Features: · The 4th generation trench gate thin wafer NPT IGBT is adopted.· FRD is built in.· The level shift circuit by high-voltage IC is built in.· The simplification of a high side driver power supply is possible by the bootstrap system.· Short Circuit Protection, Over Temperature Protection ,...
MIG15J503H: Features: · The 4th generation trench gate thin wafer NPT IGBT is adopted.· FRD is built in.· The level shift circuit by high-voltage IC is built in.· The simplification of a high side driver power ...
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Application• Integrates inverter and control circuits (IGBT drive units, and units for prote...
DescriptionThe MIG100J7CSA0A is designed for high power switching applications,motor control appli...
Application· Integrates inverter, brake power circuit and control circuits (IGBT drive units, and ...
Item |
Symbol |
Rating |
Unit | |
Power Supply Voltage |
VBB |
450 |
V | |
VBB(surge) |
500 |
V | ||
VCC |
20 |
V | ||
VBS |
20 |
V | ||
Collector-Emitter Voltage |
VCES |
600 |
V | |
Each Collector Current (DC) |
IC |
±15 |
A | |
Each Collector Current (PEAK) |
ICP |
±30 |
A | |
Input Voltage |
VIN |
5.5 |
V | |
Fault Output Supply Voltage |
VFO |
20 |
V | |
Fault Output Current |
IFO |
15 |
mA | |
PGND-SGND Voltage Difference |
VPGND-SGND |
±5 |
V | |
Output Voltage Rate of Change |
Dv/dt |
20 |
kV/s | |
Collector Power Dissipation (Per 1 IGBT Chip) |
PC |
43 |
W | |
Collector Power Dissipation (Per 1 FRD Chip) |
PC |
25 |
W | |
Operating Temperature |
TOPE |
20~100 |
°C | |
Junction Temperature | (NOTE 1) |
Tj |
150 |
°C |
Storage Temperature |
Tstg |
40~125 |
°C | |
Isolation Voltage(60Hz sinusoidal ,AC) |
VISO |
2500 (1min) |
Vrms |