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MIC5841/5842

DescriptionUsing BiCMOS technology, the MIC5841/5842 integrated circuits were fabricated to be used in a wide variety of peripheral power driver applications. The devices each have an eight-bit CMOS shift register, CMOS control circuitry, eight CMOS data latches, and eight bipolar current-sink Dar...

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MIC5841/5842: DescriptionUsing BiCMOS technology, the MIC5841/5842 integrated circuits were fabricated to be used in a wide variety of peripheral power driver applications. The devices each have an eight-bit CMOS...

MIC5841/5842 Data Sheet

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MIC5841/5842
Supply Ability:
5000

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Description

Using BiCMOS technology, the MIC5841/5842 integrated circuits were fabricated to be used in a wide variety of peripheral power driver applications. The devices each have an eight-bit CMOS shift register, CMOS control circuitry, eight CMOS data latches, and eight bipolar current-sink Darlington output drivers.

These two devices differ only in maximum voltage ratings. The MIC5842 offers premium performance with a minimum output breakdown voltage rating of 80V (50V sustaining). The drivers can be operated with a split supply where the negative supply is down to 20V.

The 500 mA outputs of MIC5841/5842, with integral transient-suppression diodes, are suitable for use with lamps, relays, solenoids and other inductive loads.

MIC5841/5842 have improved speed characteristics. With a 5V logic supply, they will typically operate faster than 5 MHz. With a 12V supply, significantly higher speeds are obtained. The CMOS inputs of MIC5841/5842 are compatible with standard CMOS, PMOS, and NMOS logic levels. TTL or DTL circuits may require the use of appropriate pull-up resistors. By using the serial data output, the drivers can be cascaded for interface applications requiring additional drive lines.

The MIC5840 family is available in DIP, PLCC, and SOIC packages. Because of limitations on package power dissipation, the simultaneous operation of all drivers at maximum rated current might require a reduction in duty cycle. A copper-alloy lead frame provides for maximum package power dissipation.




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