MHSL15055 Selling Leads, Price trend, MHSL15055 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444880 Detail

MHSL15055: HEATSINK 4.56L X1.4"H EXTRUSION

MHSL15055 Data Sheet

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Part Number:: MHSL15055
Mfg:
Supply Ability:: 5000

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1~5000

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Negotiable

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15 Days

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Upload time: 2024/5/31

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Recent History
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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	-
Manufacturer:	GE Energy	Type:	Board Level
Package Cooled:	-	Attachment Method:	Bolt On
Shape:	Rectangular	Length:	4.560" (115.82mm)
Width:	2.360" (59.94mm)	Diameter:	-
Height Off Base (Height of Fin):	1.400" (35.56mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	-	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Type: Board Level
Attachment Method: Bolt On
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Shape: Rectangular
Thermal Resistance @ Forced Air Flow: -
Thermal Resistance @ Natural: -
Package Cooled: -
Width: 2.360" (59.94mm)
Manufacturer: GE Energy
Length: 4.560" (115.82mm)
Height Off Base (Height of Fin): 1.400" (35.56mm)

Parameters:

Technical/Catalog Information	MHSL15055
Vendor	Lineage Power
Category	Thermal Management
Attachment Method	Bolt On
Height	1.4" (35.56mm)
Material	Aluminum
Package Cooled	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Outline	-
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	MHSL15055 MHSL15055

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MHSL15055

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